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LP-150-LDS is suitable for laser direct structuring for forming circuits on 3D molded components.
October 24, 2016
By: DAVID SAVASTANO
Editor, Ink World Magazine
DIC announced that it has developed LP-150-LDS, an innovative polyphenylene sulfide (PPS) compound suitable for use with laser direct structuring (LDS), a leading molded interconnect device (MID) process used for forming circuits on 3D molded components. DIC has also commenced sample shipments of the new product. LDS is a proprietary technology owned by LPKF Laser & Electronics AG, a manufacturer of printed circuit board (PCB) production equipment based in Germany. Accordingly, materials...
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